The EVK75123 is the evaluation kit for the MLX75023 and MLX75123
Time-of-Flight (TOF) chipset. This new chipset enables real-time 3D imaging
at full QVGA resolution with unsurpassed sunlight robustness. The evaluation
kit is a complete camera built around this chipset and can be directly connected
to a PC for visualization and recording of depth map data, while allowing direct
access to many configuration settings.
EVK75123 is a modular plug and play platform perfectly set up for customization by its customers. The kit consists
of four stacked PCBs (from top to bottom: illumination board, TOF chipset board, interface board and a processor
board). It is possible to detach the top two PCBs from the bottom two PCBs by bypassing the board to board
connection with an external cable suitable for FPD-Link III communication. A graphical user interface for
Windows is provided for live depth map visualization, basic recording, analysis and configuration. For custom SW
development, a MATLAB SDK and C API is also provided. The built-in flexibility of the evaluation kit enables any
designer to develop the necessary system know-how and experience for use in their application.
This kit is the 110 deg field-of-view (FOV) variant.
Features:
- MLX75023 and MLX75123 TOF Chipset
- QVGA resolution
- 120 klux sunlight rejection
- VCSEL illumination (110°)
- Modulation frequency up to 40MHz
- Distance and confidence data at max. 60 FPS
- Visualizer, C API and Matlab SDK
- Dimensions: 80 x 50 x 35mm - 15mm TOF chipset board only
Documents: